The Union Cabinet on Tuesday approved four semiconductor units under the India Semiconductor Mission (ISM), taking a total of semiconductor units in India to 10. Four upcoming units – in Bhubaneswar, Odisha, in Andhra Pradesh, there will be a total investment in Mohali in Punjab – one. 4,594 crores.
Ashwini Vaishnav, Minister of Electronics and Information Technology at a media briefing at Rail Bhavan, said, “The highest price for electronics in the world is 38% (China), which he achieved in three decades. India will reach there in 1.5 decades.” The minister said that with these four additional units, the price joint in electronics in India would currently be more than 20% to 30%.
New approved projects include SCSEM Private. Limited in Odisha, with A 2,066 crore investment, which will produce silicon carbide-based diode and mosfets; Heterogenous Integration Packaging Solutions Pvt. Ltd. 1,943 crore to produce 70,000 glass panels annually; Continental Device India Pvt. Ltd. Production capacity of up to 117 crore and 158 million units per year; And Advanced System Pvt in Package Technologies. Ltd. that will invest 468 crore to construct 96 million units of chips used in consumer electronics.
Vaishnav said, “The industry is a witness to a change in silicon carbide from silicon, as the latter remains stable under high temperature and high voltage.” “In applications such as missiles or rockets, where electronics work in extreme conditions, silicon carbide is a favorite option.”
The minister said that a dedicated research unit for silicon carbide has been set up with an investment in IIT Bhubaneswar 45 crores. “Researchers there successfully used wafers with silicon carbide powder,” he said. “They heat the powder to 2,400 ° C, convert it into vapor, which is later deposited in layers on a seed -shaped piece of silicon carbide. This process is repeated until the crystal grows about the size of the potato.
Facilities are expected to start construction in the next six months, as with the previously declared six semiconductor plants. HT has learned that the SICSEM facility in Odisha will be completed by 2027.
“India is progressing rapidly in the semiconductor sector, creating a strong ecosystem to strengthen our digital future and run global innovation. Today’s cabinet decision is related to the approval of semiconductor units in Andhra Pradesh, Odisha and Punjab.
ISM launched with an outlay in 2021 76,000 crore, so far six units have been approved – four in Gujarat, one in Assam, and one in Uttar Pradesh. The minister said that the first bunny-in-India chip is expected to come out in the first two to three months, and that there is a serious competition between three of these units to create the first time in the India Chip before 2025.
A senior IT ministry official told HT that three competitive units are all located in Gujarat, ie Tata-Micron OSAT Facility, CG Power-Renses OSAT Facility and Kaynes Technology OSAT Facility. All three are located in Sanand. To ensure this, the first “med-in-India” chip will be a packed chip, not produced by a construction unit.
The latest announcement is in India to complete at least 50-60% of its semiconductor demand in the coming decade, India told HT, Chairman of the Cellular and Electronics Association (ICEA). He said, “There are important geo-economic challenges and inserts (self-reliance) in a basic industry, and friend-shaking are important national policies for basic industries such as semici,” he said.
